3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility |
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| Author:
| Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason |
| Series title: | IEEE Press Ser. |
| ISBN: | 978-1-119-28965-4 |
| Publication Date: | Mar 2018 |
| Publisher: | John Wiley & Sons, Incorporated
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| Imprint: | Wiley-IEEE Press |
| Book Format: | Digital online |
| List Price: | USD $166.95 |
Book Description:
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic...
More Description
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools