Books By Horng, Tzyy-Sheng Jason

1.

3D IC and RF Sips: Advanced Stacking and Planar So... - a book by Hwang, Lih-Tyng

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility

Author:: Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason

ISBN:: 978-1-119-28965-4

Book Format:: Digital online

List Price:: USD $166.95

Publisher:: John Wiley & Sons, Incorporated

Publication Date:: Mar 2018

2.

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility

Author:: Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason

ISBN:: 978-1-119-28966-1

Book Format:: Digital download

List Price:: Contact Supplier contact Contact Supplier contact

Publisher:: John Wiley & Sons, Incorporated

Publication Date:: Mar 2018

3.

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility

Author:: Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason

ISBN:: 978-1-119-28964-7

Book Format:: Hardback

List Price:: USD $166.95

Publisher:: John Wiley & Sons, Incorporated

Publication Date:: Jul 2018

4.

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility

Author:: Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason

ISBN:: 978-1-119-28967-8

Book Format:: Digital download

List Price:: Contact Supplier contact Contact Supplier contact

Publisher:: John Wiley & Sons, Incorporated

Publication Date:: Mar 2018

5.

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility

Author:: Hwang, Lih-Tyng
Horng, Tzyy-Sheng Jason

ISBN:: 978-1-119-28964-7

Book Format:: Hardback

List Price:: AUD $223.95

Publisher:: John Wiley & Sons, Incorporated

Publication Date:: Apr 2018

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1.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28965-4 Book Format: Digital online List Price: USD $166.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

2.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28966-1 Book Format: Digital download List Price: Contact Supplier contact Contact Supplier contact Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

3.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28964-7 Book Format: Hardback List Price: USD $166.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Jul 2018 Quantity Note

4.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28967-8 Book Format: Digital download List Price: Contact Supplier contact Contact Supplier contact Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

5.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28964-7 Book Format: Hardback List Price: AUD $223.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Apr 2018 Quantity Note